At Embedded World 2025, leading technology companies showcased cutting-edge embedded systems innovations.
Microchip Launches PIC32A Family of 32-bit MCUs
Microchip introduced its PIC32A family of 32-bit microcontrollers (MCUs) operating at 200 MHz. These devices integrate up to 40 Msps 12-bit ADCs, high-speed 5 ns comparators, and 100 MHz Gain Bandwidth Product (GBWP) operational amplifiers, enhancing intelligent edge sensing capabilities.
Silicon Labs Unveils Series 2 BG29 Wireless SoCs
Silicon Labs announced its Series 2 BG29 family of wireless System-on-Chips (SoCs), designed for intensive Bluetooth LE applications. Ideal for wearable health and medical devices, asset trackers, and battery-powered sensors, the BG29 series offers enhanced performance for demanding applications.
Morse Micro Introduces MM8102 Wi-Fi HaLow SoC
Morse Micro launched the MM8102 Wi-Fi HaLow SoC, a low-power, long-range wireless solution optimized for IoT deployments in Europe and the Middle East. Operating in the sub-GHz ISM band, the MM8102 enables robust connectivity for various IoT applications.
LDRA Supports RISC-V Multicore Mitigation
LDRA announced that its tool suite now supports the hardware-based multicore mitigation capabilities of RISC-V processors. This includes analyzing the impact of shared resources and data coherency on worst-case execution time (WCET), aiding in the development of reliable multicore systems.
Renesas Unveils RZ/V2N MPU with AI Accelerator
Renesas introduced the RZ/V2N Microprocessor Unit (MPU) featuring the company's proprietary Dynamically Reconfigurable Processor (DRP)-AI3 accelerator. Boasting 10 TOPS/W power efficiency and AI inference performance up to 15 TOPS, the RZ/V2N enhances edge AI processing capabilities.
Altera Releases New FPGAs for Smart Edge Devices
Altera announced the Agilex 3 series of FPGAs, aimed at providing higher integration and performance for edge devices. These FPGAs offer up to 1.9× higher performance with 38% lower power consumption compared to previous generations, addressing the trade-off between size and performance in IoT system designs. Sandra Rivera, CEO of Altera, highlighted that the Agilex 3 series allows designers to innovate across various industries without compromising on performance or power efficiency. Developer kits, partner boards, and system-on-modules for the Agilex 3 FPGAs are now available.
NXP Rolls Out Automotive MCU for Zonal SDVs, Leveraging MRAM
NXP Semiconductors unveiled the S32K5, a new microcontroller family designed to accelerate the transition to zonal architectures in automotive design. Built on a 16 nm FinFET process, the S32K5 integrates embedded Magnetic RAM (MRAM) instead of conventional embedded flash storage. David Vieira, Zonal Segment Lead for Automotive at NXP, stated that these high-performance, low-latency real-time computing control MCUs address zonal architectures and electrification use cases, enabling a smooth transition from distributed ECUs to a zonal model. The S32K5 features Arm Cortex-R52 and Cortex-M7 cores running at up to 800 MHz, an integrated 2.5 Gbps Ethernet switch, CAN-XL support, and a post-quantum cryptography-ready security engine. The use of embedded MRAM offers a write speed of nearly 8.8 MB per second, significantly surpassing conventional embedded flash technologies and enhancing over-the-air update performance.
Texas Instruments Debuts ‘World’s Smallest’ MCU at Embedded World
Texas Instruments released the MSPM0C1104 MCU, claiming it as the "world's smallest MCU" at 1.6 mm x 0.861 mm, approximately the size of a 0603 passive component. The MCU operates in run mode as low as 87 µA/MHz and maintains a shutdown mode at 200 nA, making it suitable for micro-sized wearable devices. It features a 32-bit Arm Cortex-M0+ core clocked at 24 MHz, with memory options of 8 KB or 16 KB of Flash and 1 KB of SRAM. The device supports supply voltages from 1.62 V to 3.6 V and includes an internal 24 MHz oscillator with accuracy from -2% to +1.2%, reducing the need for external components. Available in seven packages, the smallest variant occupies just 1.3776 mm², about the size of a pepper flake.
Synaptics Introduces Multimodal Edge AI MCU and Triple Combo Wireless SoC
Synaptics expanded its SR Series of multimodal edge AI MCUs and introduced the new SYN461x family of wireless SoCs. The SR Series, including the SR110, SR105, and SR102, integrates high-performance edge computing with multimodal AI processing, optimizing power efficiency for IoT applications. Built on the Arm Cortex-M55 architecture with Helium technology, the SR110 and SR105 add an Arm Ethos-U55 NPU to support intelligent, always-on sensing and scalable inference capabilities. The SYN461x is an ultra-low-power wireless SoC designed for embedded Edge AI IoT applications, fabricated using a 22 nm process node. It integrates Wi-Fi 6E, Bluetooth 6.0, and IEEE 802.15.4 (Zigbee/Thread), delivering a peak data rate of 50 Mbps while maintaining low power consumption. The SoC incorporates separate processor cores for Wi-Fi and Bluetooth functions, utilizing an Arm Cortex-R4 for Wi-Fi and a Cortex-M4 for Bluetooth. Bluetooth 6.0 support includes advanced features such as Channel Sounding for distance measurement and LE Audio with Auracast broadcast capabilities.
As a leading distributor of high-quality electronic components, Futuretech Components is committed to providing cutting-edge solutions for engineers and manufacturers worldwide. Influenced by Embedded World 2025, we continue to stay at the forefront of industry trends, ensuring that our customers have access to the latest innovations in microcontrollers, FPGAs, wireless SoCs, and AI-powered processors. Whether you're designing next-generation IoT devices, automotive systems, or industrial applications, Futuretech Components is your trusted partner in sourcing reliable and high-performance components. Empowering innovation, one component at a time. 
