Texas Instruments Unveils World’s Smallest 32-bit MCU at Embedded World
Texas Instruments (TI) has unveiled the MSPM0C1104 MCU, claiming to be the world’s smallest microcontroller (MCU), measuring just 1.6 mm x 0.861 mm, approximately the size of a 0603 passive component. This breakthrough in miniaturization brings 32-bit Arm Cortex-M0+ processing power to ultra-compact devices, ideal for applications such as wearable medical and personal electronics. The MSPM0C1104 is offered in various packaging options, with the smallest form factor utilizing an eight-bump Ball Grid Array (BGA) wafer-level chip-scale package (WCSP), 38% smaller than competing MCUs.
Key Features and Specifications:
Processor: 32-bit Arm Cortex-M0+ core, running at a frequency of 24 MHz.
Memory: Options for 8 KB or 16 KB Flash and 1 KB SRAM.
Power Efficiency:
○ Run Mode: 87 µA/MHz.
○ Stop Mode: 609 µA at 4 MHz, 311 µA at 32 kHz.
○ Standby Mode: 5 µA with SRAM retention.
○ Shutdown Mode: 200 nA.
Supply Voltage: 1.62 V to 3.6 V with two 5-V tolerant open-drain peripheral pins.
Packages: Ranges from a 20-pin TSSOP with 18 GPIOs to the compact 8-pin WCSP with 6 I/O pins. The smallest variant, YCJ, occupies 1.3776 mm².
Temperature Range: Operates from -40°C to 125°C.
Peripherals: Includes an ADC with up to 10 external channels, DMA channel for ADC, three timers supporting up to 14 PWM channels, and enhanced communication interfaces such as UART, I2C, and SPI.
Applications:
This ultra-small MCU, combined with MEMS sensors and passive components, opens up possibilities for entire circuits to fit within the footprint of the chip itself. It is optimized for low-power operation, making it ideal for wearable devices and miniaturized electronics.
Manufacturing Considerations:
The miniature size of the MSPM0C1104 presents unique challenges in PCB layout and assembly. The RUK variant utilizes a 3 mm x 3 mm QFN package with a 0.4-mm lead pitch, requiring careful attention to soldering techniques. For the YCJ package, with its 0.35-mm pitch BGA bumps, TI recommends using non-solder mask-defined (NSMD) pads to accommodate the small PCB land patterns.
Availability and Development:
The MSPM0C1104 was first showcased at Embedded World 2025 on March 11. TI offers a comprehensive development ecosystem, including the MSPM0C1104 LaunchPad development kit and the MSP software development kit to support developers. Parts are available for purchase now, with compatibility across TI's broad portfolio of Cortex-M0 microcontrollers for scalability.
This innovation solidifies TI's leadership in the MCU market, pushing the boundaries of miniaturization while maintaining performance and power efficiency.
